FPC_FDC Technology Co., Ltd

Material：

Adhesive ED Adhesiveless ED Adhesive RA Adhesiveless RA

PI Thickness：

12.5um 25um 50um

FPC Thickness：

Outer Cu：

1/3oz 0.5oz 1oz

Inner Cu：

0.5 1 2

Trace Width/Spacing:

6/6mil 5/5mil 4/4mil 3/3mil 2/2mil

Min. Drill Hole：

0.15mm 0.2mm 0.25mm 0.3mm

Covering Type：

Coverlay (1-side) Coverlay (2-sides) Solder Mask (1-side) Solder Mask (2-sides)

Solder Mask:

yellow black white none

FPC Silkscreen：

white black clear

Surface Finish：

ENIG OSP Plated Gold

ENIG Gold Thickness：

1μ 2μ 3μ

Forming Method：

Laser Forming Mold Forming

Lamination sequence：

File Provided by engineers

Electrical Test：

100% FPT for Batches Test Fixture