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Material Type

ItemCapability Limit (Prototype)Capability Limit (Small/Medium Batch)
HDI board material typeRCC (65T & 100T), LDPP (IT-180A1037 and 1086), ordinary PP106 and 1080RCC (65T & 100T), LDPP (IT-180A1037 and 1086), ordinary PP106 and 1080
High Tg FR4 (halogen-free)Shengyi S1165, Kingboard HF-170Shengyi S1165, Kingboard HF-170
Normal Tg FR4 (halogen-free)Shengyi S1155, KB-6165GShengyi S1155, KB-6165G
High CTIShengyi S1600L, KB6165GC, KB-6169GTShengyi S1600L, KB6165GC, KB-6169GT
High Tg FR4FR408, FR408HR, IS410, FR406, GETEK, PCL-370HR; S1000-2, IT180A, IT-150DA; N4000-13, N4000-13EP, N4000-13SI, N4000-13EP SI; Megtron4, Megtron6 (Panasonic); EM-827 (TUC); GA-170 (Hongren); NP-180 (Nan Ya); TU-752, TU-662 (Taiyao); TU-872, MCL-BE-67G(H), MCL-E-679(W), MCL-E-679F(J) (Hitachi)IT180A, GETEK, PCL-370HR, N4000-13, N4000-13EP, N4000-13SI, N4000-13EP SI, S1000-2, S1000-2M
Ceramic powder-filled high-frequency materialRogers 4 series (RO4350B, RO4003, RO4725, RO4730), Shengyi (SJ9033, SJ9036)Rogers 4 series (Rogers4350B, Rogers4003), Shengyi (SJ9033, SJ9036)
Ceramic prepregRO4450T/F, SJ930B, SJ936BRO4450F, SJ930B, SJ936B
PTFE high-frequency materialRogers (Arlon) series, Taconic series, Taizhou Wangling F4BM/TP series, Shengyi, Guoneng, Ruilong, Zhongying, JiuyaoTaconic TLX, TLF, TLY, RF, TLC, TSM series; Rogers (Arlon) RO 3/5 series, Diclad, AD series, CLTE series, Taizhou Wangling F4BM, Shengyi
PTFE prepregRogers 6700, Taconic FR-28, RT6002Rogers 6700, Taconic FR-28
Mixed material laminationRogers (Arlon), Taconic, Nelco, Shengyi SJ and FR-4 (including local RO4350 mixed lamination)Rogers (Arlon), Taconic, Shengyi SJ and FR-4 (including local RO4350 mixed lamination)
Ordinary FR4Shengyi S1141, S1000H; Elite Material IT158; Kingboard KB-6160, KB-6165Shengyi S1141, S1000H; Elite Material IT158; Kingboard KB-6160, KB-6165


Product Type

ItemCapability Limit (Prototype)Capability Limit (Small/Medium Batch)
Rigid boardBackplane, HDI, multilayer buried/blind vias, embedded copper block, thick-copper power board, back drilling, stepped slot, metal edge plating, countersunk hole, POFV, controlled-depth drillingBackplane, HDI, multilayer buried/blind vias, thick-copper power board, back drilling, stepped slot, metal edge plating, countersunk hole, POFV, controlled-depth drilling, embedded copper block
Blind/buried via board typeLamination on the same side ≤3 timesLamination on the same side ≤3 times

Stack-up Method

ItemCapability Limit (Prototype)Capability Limit (Small/Medium Batch)
HDI board type1+n+1, 1+1+n+1+1, 2+n+2, 3+n+3, (buried via in n ≤0.3 mm), laser blind vias can be electroplated and filled1+n+1, 1+1+n+1+1, 2+n+2, 3+n+3, (buried via in n ≤0.3 mm), laser blind vias can be electroplated and filled

Surface Treatment

ItemCapability Limit (Prototype)Capability Limit (Small/Medium Batch)
TypeLead-free (leaded) HASL, electroplated nickel/gold (base copper thickness ≤2 oz), ENIG, immersion tin, electroplated tin, immersion silver, OSP, hard gold plating (with/without nickel), soft gold plating (with/without nickel), ENIG+OSP, ENIG+G/F, full-board nickel/gold plating + G/F, immersion silver + G/F, immersion tin + G/F, ENEPIGLead-free (leaded) HASL, electroplated nickel/gold (base copper thickness ≤1 oz), ENIG, immersion tin, immersion silver, OSP, hard gold plating (with/without nickel), soft gold plating (with/without nickel), ENIG+OSP, ENIG+G/F, full-board nickel/gold plating + G/F, immersion silver + G/F, immersion tin + G/F, ENEPIG
HASL1–40 μm (0.4 μm at large solderable area for leaded HASL, 1.5 μm at large solderable area for lead-free HASL)1–40 μm (0.4 μm at large solderable area for leaded HASL, 1.5 μm at large solderable area for lead-free HASL)
Pattern plating copper/nickel/goldNickel thickness ≥3 μm; gold thickness 0.025–0.1 μmNickel thickness ≥3 μm; gold thickness 0.025–0.1 μm
ENIGNickel thickness 3–8 μm; gold thickness 0.025–0.075 μmNickel thickness 3–8 μm; gold thickness 0.025–0.075 μm
Immersion tin0.8–1.5 μm0.8–1.5 μm
Electroplated tin2–10 μm2–10 μm
Immersion silver0.1–0.4 μm0.2–0.4 μm
Silver plating0.1–5 μm0.1–5 μm
OSP0.2–0.4 μm0.2–0.4 μm
Hard gold plating (cobalt-containing)0.05–4.0 μm0.05–4.0 μm
Soft gold plating0.05–2.0 μm0.05–2.0 μm
ENEPIGNickel: 3–8 μm; palladium: 0.05–0.15 μm; gold: 0.05–0.1 μmNickel: 3–8 μm; palladium: 0.05–0.15 μm; gold: 0.05–0.1 μm

Solder Mask Thickness

ItemCapability Limit (Prototype)Capability Limit (Small/Medium Batch)
Carbon ink8–20 μm8–20 μm
Green solder mask10–18 μm (on copper surface), 5–8 μm (via tenting), ≥5 μm at trace corners (single printing, copper thickness below 48 μm)10–18 μm (on copper surface), 5–8 μm (via tenting), ≥5 μm at trace corners (single printing, copper thickness below 48 μm)
Blue adhesive0.20–0.80 mm0.20–0.80 mm

Conventional Holes

ItemCapability Limit (Prototype)Capability Limit (Small/Medium Batch)
Mechanical hole diameter (finished)0.125–6.5 mm (corresponding drill bit 0.15–6.5 mm)0.125–6.5 mm (corresponding drill bit 0.15–6.5 mm)
A. Minimum finished hole diameter for PTFE material and mixed lamination0.2 mm (corresponding drill bit 0.25 mm)0.3 mm (corresponding drill bit 0.35 mm)
B. Mechanical buried/blind via diameter≤0.30 mm (corresponding drill bit ≤0.40 mm)≤0.30 mm (corresponding drill bit ≤0.40 mm)
C. Via-in-pad green solder mask plugging drill diameter≤0.55 mm (corresponding drill bit 0.6 mm)≤0.55 mm (corresponding drill bit 0.6 mm)
D. Minimum connected hole diameter0.35 mm (corresponding drill bit 0.4 mm)0.4 mm (corresponding drill bit 0.45 mm)
E. Minimum finished metallized half-hole0.30 mm (corresponding drill bit 0.35 mm)0.30 mm (corresponding drill bit 0.40 mm)
Electroplated filled laser blind via diameter0.075–0.20 mm (preferred 0.1 mm)0.1–0.15 mm (preferred 0.1 mm)
Maximum aspect ratio of electroplated filled blind via1:1 (depth includes copper thickness)1:1 (depth includes copper thickness)
Minimum line width/spacing for electroplated filled via layer3/3 mil (line-to-line); 3/3 mil (line-to-pad, pad-to-pad)3/3.5 mil (line-to-line); 3/3 mil (line-to-pad, pad-to-pad)
Lamination times for electroplated filled via board≤3 times≤3 times
Relationship between mechanical drill diameter and board thickness0.15 mm (board thickness ≤1.6 mm)0.15 mm (board thickness ≤1.2 mm)
Maximum through-hole board thickness-to-hole ratio20:1 (when drill diameter >0.2 mm)12:1 (when drill diameter >0.2 mm) (0.2 mm drill diameter is 10:1)
Hole position accuracy tolerance (compared with CAD data)±2.5 mil±3 mil
PTH hole diameter tolerance±3 mil±3 mil
Solderless device (press-fit hole) diameter±2 mil±2 mil
NPTH hole diameter tolerance±2 mil (limit +0/-2 mil or +2/-0 mil)±2 mil
Finished hole diameter range for resin plugging0.1–0.9 mm (corresponding drill 0.15–1.0 mm) (if drill diameter >0.6 mm, board thickness must be ≥0.5 mm)0.1–0.9 mm (corresponding drill 0.15–1.0 mm) (if drill diameter >0.6 mm, board thickness must be ≥0.5 mm)
Maximum aspect ratio for resin plugging (board thickness/drill)20:112:1
Minimum line width/spacing for resin plugging3/4 mil (line-to-line); 3/3.5 mil (line-to-pad, pad-to-pad)3/4 mil (line-to-line); 3/3.5 mil (line-to-pad, pad-to-pad)
Minimum laser drill hole diameter0.075 mm (maximum depth-to-diameter ratio ≤1.2:1)0.10 mm (maximum depth-to-diameter ratio ≤1:1)
Maximum depth-to-diameter ratio of mechanically controlled-depth blind via1.3:1 (hole diameter ≤0.20 mm), 1.15:1 (hole diameter ≥0.25 mm)1.3:1 (hole diameter ≤0.20 mm), 1.15:1 (hole diameter ≥0.25 mm)
Minimum depth of mechanically controlled-depth drilling (back drilling)0.1 mm0.1 mm
Back drill diameter0.4–6.5 mm0.4–6.5 mm

Back Drill Interlayer Insulation Thickness (Target Layer and Next Layer)

ItemCapability Limit (Prototype)Capability Limit (Small/Medium Batch)
Back drill interlayer insulation thickness≥0.15 mm≥0.15 mm
Back drill depth accuracy tolerance±0.075 mm±0.075 mm

Special-Shaped Holes

ItemCapability Limit (Prototype)Capability Limit (Small/Medium Batch)
Knife shapeSpecial tools: 82°, 90°, 120°, 135° (conical hole drill diameter range 0.3–10 mm)Special tools: 82°, 90°, 120°, 135° (conical hole drill diameter range 0.3–10 mm)
Conical hole, stepped hole angle and diameterOrdinary tools: angle 130° (drill diameter ≤3.175 mm), 165° (drill diameter 3.175–6.3 mm)Ordinary tools: angle 130° (drill diameter ≤3.175 mm), 165° (drill diameter 3.175–6.3 mm)
Step/taper hole angle tolerance±10°±10°
Step/taper hole opening diameter tolerance±0.15 mm±0.15 mm
Step/taper hole depth tolerance±0.10 mm±0.15 mm
Special-shaped slot tolerance (milling)±0.10 mm±0.13 mm
Controlled-depth milling slot (edge) depth accuracy (NPTH)±0.10 mm±0.10 mm
Minimum tolerance for drilled slotsNPTH slot: when slot length/slot width ≥2, tolerances in both slot length and slot width directions are ±0.05 mm; PTH slot: when slot length/slot width ≥2, tolerances in both directions are ±0.075 mm; when 2 < slot length/slot width ≤1.5, tolerances in both directions are ±0.1 mmNPTH slot: when slot length/slot width ≥2, tolerances in both slot length and slot width directions are ±0.05 mm; PTH slot: when slot length/slot width ≥2, tolerances in both directions are ±0.075 mm; when 2 < slot length/slot width ≤1.5, tolerances in both directions are ±0.1 mm
Minimum tolerance for milled slotsNPTH: slot width and slot length directions both ±0.10 mm; PTH: slot width and slot length directions both ±0.13 mmNPTH: slot width and slot length directions both ±0.10 mm; PTH: slot width and slot length directions both ±0.13 mm
Minimum inner/outer layer pad size for laser holes10 mil (for 4 mil laser hole), 11 mil (for 5 mil laser hole)10 mil (for 4 mil laser hole), 11 mil (for 5 mil laser hole)
Minimum inner/outer layer pad size for mechanical vias14 mil (8 mil drill)16 mil (8 mil drill)

Pad (Annular Ring)

ItemCapability Limit (Prototype)Capability Limit (Small/Medium Batch)
Minimum BGA pad diameter6 mil8 mil (7 mil possible with pattern plating nickel/gold process)
Pad tolerance±0.05 mm+/-1.5 mil (pad ≤10 mil); +/-10% (pad >10 mil)

Line Width / Spacing Capability

ItemCapability Limit (Prototype)Capability Limit (Small/Medium Batch)
Inner Layer
1/3 oz, 1/2 oz2.5/2.5 mil3/3 mil
1 oz3/4 mil3/4 mil
2 oz4/5 mil4/5.5 mil
3 oz5/8 mil5/8 mil
4 oz6.5/11 mil6.5/11 mil
5 oz7/13.5 mil7/14 mil
6 oz8/15.5 mil8/16 mil
7 oz9/18 mil9/19 mil
8 oz10/21 mil10/22 mil
Outer Layer
1/3 oz3/3 mil3.5/4 mil
1/2 oz3.5/3.5 mil3.5/4 mil
1 oz3.5/3.5 mil4/4 mil
2 oz6/7 mil6/8 mil
3 oz7/10 mil7/12 mil
4 oz8/13 mil8/13 mil
5 oz9/15.5 mil9/18 mil
6 oz10/18.5 mil10/21 mil
7 oz11/22 mil11/25 mil
8 oz12/26 mil12/29 mil
Line Width Tolerance (L) (High-Frequency/High-Speed Boards)
L < 5 mil±0.5 mil≤10 mil: ±1.5 mil
5 mil ≤ L ≤ 10 mil±0.8 mil±0.8 mil
L > 10 mil±1.0 mil>10 mil: ±2 mil

Design Spacing

ItemCapability Limit (Prototype)Capability Limit (Small/Medium Batch)
Minimum distance from mechanical drill to conductor (mechanical buried/blind via boards and second-order laser buried/blind vias)7 mil (one lamination), 8 mil (two laminations), 9 mil (three laminations)8 mil (one lamination), 9 mil (two or three laminations)

Other Design Spacing

ItemCapability Limit (Prototype)Capability Limit (Small/Medium Batch)
Minimum distance from mechanical drill to conductor (non-buried/blind via and first-order laser blind via)5.5 mil (≤8 layers), 6.5 mil (10–14 layers), 7 mil (>14 layers)7 mil (≤8 layers), 8 mil (>8 layers)
Minimum distance from laser drill to conductor (1st/2nd order HDI boards)5 mil5 mil
Minimum distance from outer layer traces to milling outline without copper exposure8 mil9 mil
V-CUT centerline to inner/outer layer pattern without copper exposure (H = board thickness)1.0 < H ≤ 1.6 mm: 0.36 mm (20°), 0.4 mm (30°), 0.5 mm (45°)
1.6 < H ≤ 2.4 mm: 0.42 mm (20°), 0.51 mm (30°), 0.64 mm (45°)
2.4 ≤ H ≤ 3.0 mm: 0.47 mm (20°), 0.59 mm (30°), 0.77 mm (45°)		1.0 < H ≤ 1.6 mm: 0.36 mm (20°), 0.4 mm (30°), 0.5 mm (45°)
1.6 < H ≤ 2.4 mm: 0.42 mm (20°), 0.51 mm (30°), 0.64 mm (45°)
2.4 ≤ H ≤ 3.0 mm: 0.47 mm (20°), 0.59 mm (30°), 0.77 mm (45°)
Minimum inner layer isolation band width8 mil8 mil
Minimum distance from inner layer traces to milling outline without copper exposure10 mil10 mil
Minimum distance for gold finger chamfer not to damage TAB6 mm6 mm
Minimum spacing between hole walls of the same net6 mil (through hole, laser blind via), 8 mil (mechanical blind/buried via)6 mil (through hole, laser blind via), 8 mil (mechanical blind/buried via)
Minimum spacing between ENIG pads3.5 mil (corresponding to base copper 12 μm, 18 μm)4 mil (corresponding to base copper 12 μm, 18 μm)
Minimum spacing between gold fingers5 mil6 mil
Minimum spacing between HASL pads (without solder mask)7 mil (pad isolation within large copper area: 10 mil)7 mil (pad isolation within large copper area: 10 mil)
Minimum isolation between blue adhesive and pad14 mil16 mil
Minimum isolation between legend and pad5 mil (screen printing process), 4 mil (printing process)6 mil (screen printing process)
Minimum isolation between carbon ink and carbon ink13 mil15 mil

Special Substrate · Metal Core Board

ItemCapability Limit (Prototype)Capability Limit (Small/Medium Batch)
Metal core board - layers1–8 layers (aluminum substrate, copper substrate); 2–24 layers (cold plate, sintered plate, embedded metal plate)1–8 layers (aluminum substrate, copper substrate); 2–24 layers (cold plate, sintered plate, embedded metal plate)
Metal core board - finished size rangeMAX: 610 × 610 mm, MIN: 5 × 5 mm (aluminum substrate, copper substrate, cold plate, sintered plate, embedded metal plate)MAX: 610 × 610 mm, MIN: 5 × 5 mm (aluminum substrate, copper substrate, cold plate, sintered plate, embedded metal plate)
Metal core board - finished board thickness range0.5–5.0 mm0.5–5.0 mm
Metal core board - copper thickness range0.5–10 oz0.5–8 oz
Metal core board - metal base thickness0.5–5.0 mm0.5–5.0 mm
Metal core board - metal base materialAluminum: 1100/1050/2124/3003/4045/5052/6061; copper: pure copper; pure iron, stainless steelAluminum: 1100/3003/4045/5052/6061; copper: pure copper; pure iron

Metal Core Board · Type

ItemCapability Limit (Prototype)Capability Limit (Small/Medium Batch)
Metal core board - minimum finished hole diameter and toleranceNPTH: 0.5 ± 0.05 mm; PTH: 1.0 ± 0.10 mm (aluminum substrate, copper substrate), 0.2 ± 0.10 mm (cold plate, sintered plate, embedded metal plate)NPTH: 0.5 ± 0.05 mm; PTH: 1.0 ± 0.10 mm (aluminum substrate, copper substrate), 0.2 ± 0.10 mm (cold plate, sintered plate, embedded metal plate)
Metal processing dimensional accuracy (including blind slot depth control accuracy)±0.03 mm±0.05 mm
Metal core board - PCB part surface finishLeaded/lead-free HASL; OSP; immersion nickel (palladium) gold; electroplated (nickel) soft/hard gold; electroplated tinLeaded/lead-free HASL; OSP; immersion nickel (palladium) gold; electroplated (nickel) soft/hard gold; electroplated tin
Metal core board - metal part surface finishCopper: nickel/gold plating; aluminum: anodizing, hard anodizing, chemical passivation; mechanical treatment: sandblasting, brushingCopper: nickel/gold plating; aluminum: anodizing, hard anodizing, chemical passivation; mechanical treatment: sandblasting, brushing
Metal core board - metal base materialQuanbao (T-110, T-111), Tenghui (VT-4A1, VT-4A2, VT-4A3), Laird (1KA04, 1KA06); Bergquist (MP06503, HT04503), TACONIC (TLY-5, TLY-5F)Quanbao (T-110, T-111), Tenghui (VT-4A1, VT-4A2, VT-4A3), Laird (1KA04, 1KA06); Bergquist (MP06503, HT04503), TACONIC (TLY-5, TLY-5F)
Metal core board - thermal conductivity0.3–3 W/m·K (cold plate, aluminum substrate, copper substrate); 8.33 W/m·K (sintered plate); 0.35–30 W/m·K (embedded metal plate), 280 W/m·K (thermoelectric separation plate)0.3–3 W/m·K (cold plate, aluminum substrate, copper substrate); 8.33 W/m·K (sintered plate); 0.35–30 W/m·K (embedded metal plate)
Metal core board - thermal adhesive thickness (dielectric layer)75/100/125/150/200/250 μm75/100/125/150/200/250 μm
Metal core board - embedded copper block size3 × 3 mm–70 × 80 mm3 × 3 mm–70 × 80 mm
Metal core board - embedded copper block height difference accuracy±40 μm±40 μm
Metal core board - distance from embedded copper block to hole wall≥12 mil≥12 mil

Special Substrate · Ceramic Board

ItemCapability Limit (Prototype)Capability Limit (Small/Medium Batch)
Ceramic board - layers1–2 layers1–2 layers
Ceramic board - finished size rangeMAX: 140 × 140 mm, MIN: 5 × 5 mmMAX: 100 × 100 mm, MIN: 5 × 5 mm
Ceramic board - metal part surface finishOSP, ENIG, immersion silver, immersion tin, ENEPIGOSP, ENIG, immersion silver
Ceramic board - ceramic board dielectric thickness0.2, 0.25, 0.3, 0.381, 0.5, 0.635, 0.8, 1.0, 1.2, 1.5 mm0.2, 0.25, 0.3, 0.381, 0.5, 0.635, 0.8, 1.0, 1.2, 1.5 mm
Ceramic board - ceramic board copper thickness35, 60, 150 μm and above35, 60, 150 μm and above
Ceramic board - ceramic board materialCeramic TLCC, HTCC, DBC, DPC materials (AlN and Al₂O₃)Ceramic TLCC, HTCC, DBC, DPC materials (AlN and Al₂O₃)
Ceramic board - thermal conductivity24–220 W/m·K24–220 W/m·K

Other Design Parameters

ItemCapability Limit (Prototype)Capability Limit (Small/Medium Batch)
Minimum inner layer board thickness0.05 mm (non-buried/blind via board), 0.13 mm (with buried/blind via drilling)0.075 mm (non-buried/blind via board), 0.13 mm (with buried/blind via drilling)
Layers1–40 layers1–32 layers
Board thickness range0.2–7.0 mm0.45–6.0 mm
Minimum finished size2 × 2 mm10 × 10 mm
Maximum finished size≤2 layers: 26 × 45 inch; ≥3 layers: 25.5 × 38 inch≤2 layers: 26 × 45 inch; ≥3 layers: 25.5 × 38 inch
Interlayer registration≤4 mil (below 8 layers)≤5 mil (below 8 layers)
Board thickness toleranceBoard thickness ≤1.0 mm: ±0.1 mm; board thickness >1.0 mm: ±10%Board thickness ≤1.0 mm: ±0.1 mm; board thickness >1.0 mm: ±10%
Special board thickness tolerance requirements (no interlayer structure requirement)≤2.0 mm board: ±0.1 mm; 2.1–3.0 mm board: ±0.15 mm; 3.1–7.0 mm board: +/-0.25 mm≤2.0 mm board: ±0.13 mm; 2.1–3.0 mm board: ±0.15 mm; 3.1–6.0 mm board: +/-0.3 mm
Impedance toleranceSingle-ended: ±5 Ω (≤50 Ω), ±10% (>50 Ω) (limit capability: ±5% (≥50 Ω)); differential: ±5 Ω (≤50 Ω), ±10% (>50 Ω) (limit capability: ±5%)±5 Ω (<50 Ω), ±10% (≥50 Ω)
Outline dimension tolerance±0.05 mm±0.1 mm
Outline position tolerance±0.075 mm±0.1 mm
Warpage limit capability0.5%0.75%
Maximum finished copper thickness of inner/outer layersInner layer: 8 oz; outer layer: 8 ozInner layer: 4 oz; outer layer: 6 oz
Minimum insulation layer thickness2 mil (limited to H0Z base copper)2 mil (limited to H0Z base copper)
Minimum legend line width and heightLine width 4 mil, height 23 mil (12 μm, 18 μm base copper); line width 5 mil, height 30 mil (35 μm base copper); line width 6 mil, height 45 mil (70 μm base copper)Line width 4 mil, height 23 mil (12 μm, 18 μm base copper); line width 5 mil, height 30 mil (35 μm base copper); line width 6 mil, height 45 mil (70 μm base copper)
Minimum inner corner radius0.3 mm0.3 mm
V-CUT angle tolerance±5°±5°
V-CUT symmetry tolerance±4 mil±4 mil
V-CUT web thickness tolerance±4 mil±4 mil
V-CUT board thickness rangeBase board thickness (excluding outer copper) ≥0.4 mm, finished board thickness ≤3.2 mm; base board thickness ≤0.6 mm: single-sided V-cut is preferredBase board thickness (excluding outer copper) ≥0.4 mm, finished board thickness ≤3.2 mm; base board thickness ≤0.6 mm: single-sided V-cut is preferred
Outline methodMilling; V-CUT; bridge; stamp holesMilling; V-CUT; bridge; stamp holes
Minimum solder mask bridge widthBase copper ≤1 oz: 4 mil (green); 5 mil (other colors); 6 mil (solder mask bridge on large copper area); base copper 2–4 oz: 20 milBase copper ≤1 oz: 4 mil (green); 5 mil (other colors); 6 mil (solder mask bridge on large copper area); base copper 2–4 oz: 20 mil; 8 mil
Minimum single-side solder mask opening2 mil (local 1.5 mil allowed)2 mil
Minimum edge distance from solder mask opening to trace3 mil3 mil
Minimum distance from solder mask opening to non-plated hole6 mil7 mil
Solder mask ink colorsGreen (matte), yellow, black (matte), blue, red, white, purple, transparentGreen (matte), yellow, black (matte), blue, red, white, purple, transparent
Legend ink colorsWhite, yellow, blackWhite, yellow, black
Gold finger chamfer angle tolerance±5°±5°
Gold finger chamfer residual thickness tolerance±5 mil±5 mil
Minimum test continuity resistance10 Ω (four-wire test: 0.3 mΩ)10 Ω (four-wire test: 0.3 mΩ)
Maximum test insulation resistance100 MΩ100 MΩ
Maximum test voltage300 V300 V



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