Finished Product

No. of Layer

1-40 Layers

HDI

Tier 1-3

Thickness

0.6-3.2mm

Tolerance of Thickness

Thickness≥1.0mm

±10%

Thickness＜1.0mm

±0.1mm

Max. Dimensions

1-4 Layers

520×600mm

≥6 Layers

400×500mm

Panel Frame

≥3mm

EMP

Support

CHP

Support

POFV

Support

BVCF

Support

Cut Lamination

Materials

Material

FR-4

Brand

SYTECH、KINGBOARD、GDM etc.

Level

A

TG

130℃/150℃/170℃

CTI

≥175V

Breakdown Voltage

≥4000V

Fire Prevention

UL-94 V0

Drill

Circle Hole

Electro Drill

0.15mm≤hole dia.≤6.35mm

Laser Drill

0.075mm≤hole dia.≤0.15mm

Slot Hole

ETH

≥0.50mm

NETH

≥0.80mm

Half Hole

Diameter

≥0.5mm

Spacing

≥0.9mm

Tolerance of Hole Site

±0.075mm

Tolerance of Diameter

PTH（Standard）

±0.075mm

PTH（PFH）

±0.05mm

NPTH

±0.05mm

Hole Slot

±0.1mm

Plating

Material Copper Thickness（OZ）

Inner Layer

0.5-4

Outer Layer

1~4

Plating Copper Thickness（μm）

≥20

Hole Copper Thickness（μm）

Through Hole

Standard≥20

Mechanical Blind Hole

Standard≥20

Electroplating of borehole（μm）

dimple

≤10

Photolithography

Tolerance of Line Width

±20%

Inner Layer min. width/spacing

0.5OZ（18μm）

≥2.5/3.0 mil

1OZ（35μm）

≥3.0/3.0 mil

2OZ（70μm）

≥5.5/5.5 mil

Outer Layer max. width/spacing

1OZ（35μm）

≥3.0/3.0 mil

2OZ（70μm）

≥5.5/5.5 mil

Net min. width/spacing

1OZ（35μm）

≥6.0/6.0 mil

2OZ（70μm）

≥10/10 mil

Min. welding hoop

1OZ（35μm）

TH

≥3.5mil

CH

≥8mil

2OZ（70μm）

TH

≥4.5mil

CH

≥10mil

BGA pad dia.

SnPb

≥10mil

Immersion gold

≥8mil

Min. BGA pad pitch

≥0.45mm

Impedance

＞50Ω tolerance

±10%

≤50Ω tolerance

±5Ω

Single-Ended

≤75Ω

Differential

≤150Ω

Solder Mask

Color

Green, Blue, Red, Yellow, White, Black, Matte Black

Solder mask thickness

15±10μm

Solder Mask Opening (SMO)

≥1.5mil

Solder Mask Bridge

Green：≥3.5mil

White/Black：≥5mil

Other Color：≥4mil

Hole Type

Via Covering

Via Openning

Via Filling

Via Resin Filling

Filling

Hole diameter

0.2mm＜dia.≤0.45mm

Silkscreen

Silkscreen

Color

White, Black

Etching

Width/Height

≥4mil/25mil

Silkscreen

1OZ（35μm）

Width/Height

≥5mil/30mil

2OZ（70μm）

Width/Height

≥7mil/42mil

3OZ（105μm）

Width/Height

≥12mil/50mil

Ink jet

Width/Height

0.075mm/0.6mm

Surface Finish

Surfacing

HAL/HASL, Immersion gold, OSP, Plating gold

Coating Thickness (μin)

Immersion gold

Nickel

100-200

Gold

Plating Nickel gold

Nickel

120-200

Gold

Immersion gold

Minimum spacing between gold fingers and pads

≥5mil

Forming

Form tolerance

±0.15mm

Trace to board edge

CNC Milling

≥0.20mm

V-cut

Angle

30°、45°、60°

Max. V-cut 

≤30

External width

60mm≤  ≤480mm

Excess thickness

0.25-0.5mm

Tolerance

±0.1mm

Beveled edge of Finger

Beveled plate thickness

0.8-2.0mm

Beveled edge Dimension

Length

30-280mm

Height

≥40mm

Beveled edge angle

20°30°45°60°

Tolerance

±5°

Deepth tolerance

±0.15mm

E-Testing

Testing Point

Flying probe testing

Any

Testing fixture

＜14000 points

IC&BGA dimension

≥8mil

FQC

Warpage

0.75%

Others

Finishing

Single pieces

Panels

Panelization

0-Gap Panelization

Panelization Gap

Gap＞1.6mm

Stamp Hole Panelization

Shipping Report

Standard Report

Slice Report

Impedance Test Report