Rigid-flex PCB_FDC Technology Co., Ltd

Via Processing：

Tented Vias Opened Vias Solder Mask Plug (IV-B) Non-Conductive Fill & Cap (VII)

Surface Finish：

ENIG OSP Immersion Silver

Gold Thickness：

1μ″ 2μ″ 3μ″

TG Rating：

TG130 TG150 TG170

PCB Thickness：

Solder Mask:

Silkscreen：

white black clear

Outer Outer Cu：

1oz 2oz 3oz 4oz 5oz 6oz

Inner Cu：

1oz 2oz 3oz 4oz 5oz 6oz

FPC Layer Count：

1 2 3 4 5 6

FPC Thickness：

0.1mm 0.13mm 0.15mm 0.2mm 0.25mm

Covering Type：

Coverlay (1-side) Coverlay (2-sides) Solder Mask (1-side) Solder Mask (2-sides)

Solder Mask：

yellow black white clear

FPC Silkscreen：

white black clear

Material：

Adhesive ED Adhesiveless ED Adhesive RA Adhesiveless RA

PI Thickness：

12.5um 25um 50um

Outer Cu：

1/3oz 0.5oz 1oz

Forming Method：

Laser Forming Mold Forming

Stiffener Type：

Not Required Stainless Steel Stiffener Aluminum Stiffener FR4 Stiffener PI Stiffener

Adhesive Backing：

Not Required Required

EMI Shielding Film：

Not Required Low R (1-side) Low R (2-sides)

Blind/Buried Vias：

No Yes

Impedance Control：

No Yes

Plated Half-holes：

No Yes

Edge Plating：

No Yes

Conductive Adhesive：

No Yes

Electrical Test：

100% FPT for Batches Test Fixture

If Data Conflicts：

Follow Order Parameters Follow Files Ask for Confirmation

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