
Welding Surface | Single-sided welding (SMT + Through-hole) | Single/Double Sided Soldering (SMT + Through-hole) |
Number of Layers | 2, 4, 6 layers | Unlimited |
Thickness Range | 0.8mm - 1.6mm | Unlimited |
Size | 10*10mm - 470*570mm | 70*70mm - 460*510mm |
Quantity | Sample board (≤30(50) pieces) | 2 pieces minimum, no upper limit |
Plating on Pads | Restricted | Unlimited |
PCB Color | Restricted | Unlimited |
PCB Shipping Method | Single board, tab-routed panelization | Single panel, tabbing, V-groove |
Process Edge | Not required | Absolutely Necessary |
Mark Points | Not required | Required |
SPI Solder Paste Inspection | None | Yes |
Automated Optical Inspection (AOI) | None | Individual Testing |
Minimum Package | 402 | 201 |
Minimum IC Pin Pitch | 0.4mm | 0.35mm |
BGA Ball Diameter Spacing | 0.5mm | 0.3mm |
Reflow Soldering Temperature | 255+/-5 degrees (non-adjustable) | 240+/-5 degrees |